A Kelvin Thermal TGP (Thermal Ground Plane) is a thin vapor chamber, i.e. a 2-D flat heat pipe, fabricated using flexible printed circuits (FPC)-compatible processes. It can be low-cost, thin (0.15 - 0.25mm), light (0.05 - 0.15 g/cm2), flexible (bending radius of 10 - 3mm) and large (100 - 1,000mm) for heat fluxes ranging from 1 to 1,000 W/cm2.  TGP is an enabling cooling technology for smartphones, tablets, laptop PCs, ARs/VRs and other wearable electronics. TGP is also critical to high power and/or high heat flux applications such as GaN/SiC-based power electronics, battery packs in electric vehicles, and edge and cloud computing systems. Kelvin Thermal TGPs with effective thermal conductivities ranging from 4,000 to 25,000 W/mK, reduce a system's skin and junction temperatures with less dimensional constraints in design than existing thermal management solutions using metal (200 to 400 W/mK), graphite (400 to 1,500 W/mK), heat pipes and traditional vapor chambers. Kelvin Thermal designs application-specific TGPs for customers with a need of 100 to 1,000,000 TGPs/month.